基于ISL3300x设计的I2C总线扩展方案
[10-10 20:38:44] 来源:http://www.88dzw.com 单片机学习 阅读:8150次
文章摘要:The ISL3300x MSOP package IC is soldered onto the evaluation board and is designated as U1. A typical application of the ISL3300x is an I2C bus buffer. The evaluation board contains all the necessary components to interface the buffer to an I2C bus. Discrete NMOS transistors are used to produce the
基于ISL3300x设计的I2C总线扩展方案,标签:单片机开发,单片机原理,http://www.88dzw.comThe ISL3300x MSOP package IC is soldered onto the evaluation board and is designated as U1. A typical application of the ISL3300x is an I2C bus buffer. The evaluation board contains all the necessary components to interface the buffer to an I2C bus.
Discrete NMOS transistors are used to produce the pull-down functions of a wired-AND bus. Each SDA/SCL pin on the buffer is connected to an external open-drain NMOS transistor. The evaluation board also contains connections for the bus pull-up resistor and load capacitance. The logic input pins on the ISL3300x IC can be held logic High by a pull-up resistor or driven dynamically with an external logic source.
ISL3300x评估板主要特性:
• Evaluation Board for ISL33001IUZ, ISL33002IUZ, and ISL33003IUZ IC in MSOP Package
• +2.3V to +5.5V Supply Operation
• Configured to operate in I2C environment
• Two Channel Supply for Level Shifting Applications (ISL33002 and ISL33003)
• On-Board Discrete NMOS Open-Drain Transistors Connected to SDA/SCL Pins
• 3V Logic for NMOS Transistor Gate
• On-Board Discrete Bus Pull-Up Resistors and Load Capacitance on SDA/SCL Pins
• Convenient Test Points on SDA/SCL pins

图3. ISL3300x评估板外形图

图4. ISL3300x评估板电路图
ISL3300x评估板材料清单(BOM):

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