Moldflow在电子芯片封装上的运用

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Moldflow在电子芯片封装上的运用，文件名：moldflow icchip.ppt

Moldflow的芯片封装解决方案，Moldflow Microchip Encapsulation Solution
Moldflows wire-sweep analyzes the deformation of bonding wires that connect the chip to the leadframe during encapsulation.

 Uses numerical simulation method to get accurate calculation of wire sweep.

Flow analysis using Moldflows Reactive Molding to obtain fluid velocity and viscosity around the wires

 Flow analysis calculates drag force along the wire

Wire deformation analysis calculates wire deformation， 大小：776 KB